Top 10 Best Potting Compound

of November 2024

MG Chemicals

MG Chemicals - 832HD-50ML 832HD Black 1:1 Epoxy Encapsulating and Potting Compound, 45 milliliters Dual Pneumatic Dispenser

Exceptional

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Clearcast 7000

Epoxyseal 9000 Electronic Grade Potting Epoxy, Epoxy Resin PCB Coating, Electronic Potting Epoxy, Casting Epoxy - 48oz KIT.

9.9

Exceptional

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MG Chemicals

MG Chemicals - 832WC-375ML Water Clear Epoxy, Potting and Encapsulating Compound, 375 mL, 2-Part Kit

9.8

Exceptional

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The Epoxy Experts, MAX EPOXY SYSTEMS

MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts

9.7

Exceptional

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MG Chemicals

MG Chemicals - 832B-375ML Black Epoxy Encapsulating and Potting Compound, 12 oz Liquid Kit

9.6

Exceptional

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MG Chemicals

MG Chemicals 832TC-450ML Thermally Conductive Epoxy Encapsulating and Potting Compound, 15 oz Kit, Black

9.5

Excellent

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The Epoxy Experts

MAX MCR -Electronic Grade Potting Compound 4 Circuit Board, PCB Encapsulating, Embedding, Opaque Black Masking, Thin, Injectable, 1.5 Inch Thick Casting, Low Exotherm, Medium Set Time, 1.5 Gallon Kit

9.4

Excellent

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The Epoxy Experts, MAX EPOXY SYSTEMS

MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits, Read Description Below

9.3

Excellent

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MG Chemicals

MG Chemicals 8810 Black Rigid Urethane 2-Part Potting Compound, 375mL Kit

9.2

Excellent

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MG Chemicals

MG Chemicals - 832FX-450ML Black Flexible Epoxy Encapsulating and Potting Compound, 450 mL, 2-Part Kit,

9.1

Excellent

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About Potting Compound

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MG Chemicals - 832HD-50ML 832HD Black 1:1 Epoxy Encapsulating and Potting Compound, 45 milliliters Dual Pneumatic Dispenser

Non-corrosive. Flow able and high durability. Very high tensile and compressive strength. Easy mix ratio 1A 1B by volume. Protects electronics from moisture, humidity, corrosion and static discharges.

Epoxyseal 9000 Electronic Grade Potting Epoxy, Epoxy Resin PCB Coating, Electronic Potting Epoxy, Casting Epoxy - 48oz KIT.

EPOXYSEAL 9000 electr.

MG Chemicals - 832WC-375ML Water Clear Epoxy, Potting and Encapsulating Compound, 375 mL, 2-Part Kit

Optically Clear color allows visual inspection. Uv light stable non-yellowing. Very low mixed viscosity of 980 cp. Convenient 2A 1B volume mix ratio. Broad service temperature range -40 to 140 c -40 to 284 f.

MAX MCR Electronic Grade Epoxy Potting Compound for Printed Circuit Boards, Electronic Encapsulation, Waterproofing, Permanent Circuit Masking, None Conductive Epoxy Resin, DC/AC Up to 500 Volts

Electronic Potting and Encapsulating Compound For Printed Circuit Board -Insulate ACDC High And Low Voltage. Bonds to ABS PVC Plastic Housing, Wire Jackets, Mold Injected Components, Powder Coated And Metal Substrates. None Electrically Conductive Epoxy Resin For Waterproofing And Embedding Electronic Components. Opaque Black For Permanent Masking, Room Temperature Curing, 21 Mix Ratio, Medium Setting. Low Viscosity, Self Leveling, Medium Set Time, Cures Very Rigid, Up To 190F 90C Operating Temperature.

MG Chemicals - 832B-375ML Black Epoxy Encapsulating and Potting Compound, 12 oz Liquid Kit

Non-porous, water and chemical resistant. Extremely impact resistant contains a form of nylon. Affords high security, once cured, extremely difficult to remove. Non-conductive, an electrical insulator. Low toxicity, suitable for explosion proof components spark arresting.

MG Chemicals 832TC-450ML Thermally Conductive Epoxy Encapsulating and Potting Compound, 15 oz Kit, Black

Excellent electrical and thermal conductivity. Easy 11 mix ratio. Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons. Suitable for large production runs. Excellent machining properties.

MAX MCR -Electronic Grade Potting Compound 4 Circuit Board, PCB Encapsulating, Embedding, Opaque Black Masking, Thin, Injectable, 1.5 Inch Thick Casting, Low Exotherm, Medium Set Time, 1.5 Gallon Kit

Electronic Potting and Encapsulating Compound For Printed Circuit Board -Insulate ACDC High And Low Voltage. Bonds to ABS PVC Plastic Housing, Wire Jackets, Mold Injected Components, Powder Coated And Metal Substrates. None Electrically Conductive Epoxy Resin For Waterproofing And Embedding Electronic Components. Opaque Black For Permanent Masking, Room Temperature Curing, 21 Mix Ratio, Medium Setting. Cures Very Rigid, Up To 190F 90C Operating Temperature.

MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits, Read Description Below

Epoxy Potting Compound, Thermally Conductive For Fast Heat Dissipation. Large Mass, Thick Cross-Section, Low Exothermic Heat Generation. Lower Viscosity Compared To Other Thermally Conductive Potting Compound. Insulates ACDC Current, Suitable For High And Low Voltage Insulating. Long Working Time - Cures In 24 Hours 25C- Heat Curable For Faster Processing.

MG Chemicals 8810 Black Rigid Urethane 2-Part Potting Compound, 375mL Kit

21 mix ratio. 45 minutes working life. 24 hour cure at room temperature. Low exothermic. Excellent dielectric properties.

MG Chemicals - 832FX-450ML Black Flexible Epoxy Encapsulating and Potting Compound, 450 mL, 2-Part Kit,

Flexible and high durability. Mix ratio 1A 1B compatible with most dispensing equipment. Resistance to water and humidity. Protects electronics from moisture, corrosion, thermal shock, and static discharges. Flow able and free of solvent parts.